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Thermal Solutions Product List

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Heat dissipation solution "Heat Dissipation Sheet"

Heat dissipation solution "Heat Dissipation Sheet"

Widely usable between heat sources and heat dissipation plates! Heat dissipation sheet that can be attached to heat sources.

The "heat dissipation sheet" is a user-friendly heat dissipation material. While automation is challenging, it can be delivered pre-cut to the desired shape, making it easy to use. Although stress on the substrate and components is a concern, there are sheet products made from very soft materials that can wrap around components to solve this issue. Additionally, we also offer recommended "heat dissipation grease" and "heat dissipation gap fillers." 【Features】 ■ Used by adhering to the heat source ■ Easy thickness management ■ High reworkability ■ Thermal conductivity: (insulating) up to 12 W/m·K, (conductive) up to 40 W/m·K *For more details, please refer to the related links or feel free to contact us.

  • Other electronic parts
  • Thermal Solutions

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Heat dissipation solution

Heat dissipation solution

We will introduce three materials recommended by our company, starting with the "heat dissipation sheet"!

The management of "heat" emitted by motors and semiconductor components greatly affects the performance and reliability of equipment. In various fields such as automotive, telecommunications, home appliances, and industrial equipment, the use of high thermal conductivity TIM (Thermal Interface Material) is essential for compact and high-performance electronic devices. Thermal interface materials (TIM) are one of our specialty products. We propose appropriate thermal solutions according to the required thermal characteristics, as well as the application, shape, and manufacturing method. 【Three Recommended Materials】 ■ Thermal Sheets - Thermal Conductivity: (Insulating) up to 12 W/m·K (Conductive) up to 40 W/m·K ■ Thermal Grease - Thermal Conductivity: (Insulating) up to 6 W/m·K ■ Thermal Gap Fillers - Thermal Conductivity: (Insulating) up to 5 W/m·K *For more details, please refer to the related links or feel free to contact us.

  • Other polymer materials
  • Other electronic parts
  • Thermal Solutions

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TPR Corporation's heat dissipation solutions for electronic devices.

TPR Corporation's heat dissipation solutions for electronic devices.

A diverse range of products from TPR Corporation that solve thermal issues in electronic devices.

In the electronics industry, as products become smaller and more high-performance, heat dissipation measures have become an important issue. In particular, electronic components with high-density mounting have an increased risk of performance degradation and failure due to heat generation. If appropriate heat dissipation measures are not implemented, it can shorten the product's lifespan and compromise its reliability. TPR Corporation's products aim to address these challenges and maximize the performance of electronic devices. 【Usage Scenarios】 - Smartphones, tablets - PCs, servers - LED lighting - Power semiconductors 【Benefits of Implementation】 - Increased product lifespan - Stabilization of performance - Improved reliability

  • others
  • Thermal Solutions

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